Model: MBD-C7H61-O

Backplane Assembly

Properties:

End Application
Intel 2nd and 3rd gen core i7, i5, i3, pentium, celeron processors
Part Name Assigned By Controlling Agency
Motherboard, core board
NSN
5998-01-623-7268
Part Number
MBD-C7H61-O
Description
Backplane Assembly
CAGE
0T0Y9

An insulating panel upon which two or more connector, receptacle, electrical, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. it provides or completes a circuit between two or more circuit card assembly or electronic components assembly. it may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. includes motherboards. for items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see printed wiring board. see also printed circuit board; circuit card assembly and cable assembly, printed, flexible.

Part MBD-C7H61-O NSN 5998-01-623-7268

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
34736
FIIG:
A511K0
Concept No.:
App. Key:
Cond. Code:
1
Status:
A

Material Classification

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
CRITL:
X

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Schedule B and Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Freight Class: Electronic integrated circuits and microassembly parts

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